Obligations: Companies must comply with the new evaluation standards for token factories, focusing on core technical metrics like model adaptation capacity and energy efficiency. • Opportunities: Firms with leading token factories can receive government support. Companies involved in model technology iteration, chip adaptation, and overseas service development can tap into new market opportunities. • Deadlines: The plan is set for implementation from 2026 to 2028, with specific milestones for building factories, launching platforms, and achieving technology breakthroughs.
Obligations: Companies in the electronics manufacturing sector must align their R&D and production strategies with the plan's goals, particularly in developing advanced chips and promoting domestic operating systems.
Obligations: Software companies are required to participate in the initiative, develop intelligent software products, and cooperate with terminal manufacturers for joint innovation. • Opportunities: Companies can benefit from government funding and support to develop new intelligent software products and participate in the creation of benchmark applications. • Deadlines: By 2028, the initiative aims to cover 20,000 large-scale software enterprises and create 100 benchmark applications.