产品官方一手
小米XRing O3芯片量产，MiMo实现端侧运行
Xiaomi XRing O3 Enters Mass Production as MiMo Goes On-Device and O100/D100 Target 2027
精选理由
小米量产XRing O3芯片，MiMo实现端侧运行，O100/D100瞄准2027年商用。
小米XRing O3芯片已进入量产阶段，MiMo模型可在设备端运行。O100 AI加速器和D100智能驾驶芯片计划于2027年上半年商用。这一举措将小米自研芯片和端侧AI战略扩展到单一手机发布之外。
原文 · pandaily
Xiaomi XRing O3 Enters Mass Production as MiMo Goes On-Device and O100/D100 Target 2027
Xiaomi's XRing O3 SoC has entered mass production with MiMo running on-device, while the O100 AI accelerator and D100 intelligent-driving chip are targeted for commercial use in the first half of 2027. The move extends Xiaomi's in-house chip and on-device AI strategy beyond a single handset launch.
