马来西亚nanoSkunkWorkX获200万美元融资
Malaysian Deep-Tech Startup nanoSkunkWorkX Raises US$2M to Qualify AI Chip Packaging Interface
精选理由
马来西亚nanoSkunkWorkX获200万美元，专注AI芯片封装接口技术，助力马来西亚半导体发展。
马来西亚深科技初创公司nanoSkunkWorkX完成200万美元融资，由Tin Men Capital领投。这笔资金将用于推进其石墨烯-铜接口技术，使其通过半导体合作伙伴的资格认证。马来西亚正积极推动先进封装技术发展。
原文 · Asia Tech Daily
Malaysian Deep-Tech Startup nanoSkunkWorkX Raises US$2M to Qualify AI Chip Packaging Interface
The Tin Men Capital-led round will move nSWX’s graphene-copper interface toward semiconductor partner qualification as Malaysia pushes deeper into advanced packaging. Malaysian deep-tech startup nanoSkunkWorkX (nSWX) has raised US$2 million […]
